Description:	Schematic representation of static stencil lithography. (a): a stencil is brought in contact or proximity to a substrate, (b): the stencil/substrate combination is placed in a deposition chamber and a controlled amount of material is deposited through the stencil onto the substrate and, (c): the stencil is removed from the substrate. The apertures in the stencil are successfully transferred onto the substrate and the stencil can be reused for a subsequent process step.
Courtesy:	Juergen Brugger
Institution:	Ecole Polytechnique Federale de Lausanne
Country:	USA
Source:	E-nano Newsletter, 08, p.023 (2007)